Planing Machine Cleveland GAPU-5

Cleveland · GAPU-5

Caractéristiques techniques

Description

Year of construction: 2010, condition: used, Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package). Accessories: Total enclosure, Camera system, image field 20 x 16 mm Extraction system 4000/3 D 240 3kW 630 m³/h Swivel unit for package dressing Software for converting DXF files to CNC files on PC Touchscreen Standard software for straight, bevel or radii etc. DXF files. Single Diamond- / CBN grinding wheel diameter: 400 mm Single-disc width: 30 mm Packages: packages to Ø 150 mm and width 150 mm Swivel axis: swivel plate for swivel angle: +/- 95 degrees Delivery axis travel: 82 mm Oscillation hub : 83 mm Spindle mounting diameter: 60 mm DIA/CBN wheel flange hole: 32 mm Speed of silicon wafer: 700 - 2800 rpm SIC Grinding Spindle: 60 mm Ø Workpiece clamping X-axis travel: 185 mm Y-axis travel: 194 mm Csupdjy Tl Iaj S T Uehb Workpiece spindle head holder diameter : 100 mm with belt spindle diameter : 100 x 200 mm Grinding wheel balance: max. 40 kg Workpiece spindle speed: 500 - 1500 rpm SIC discs up to max.: 200 x 20 mm x 32 mm Connected load: approx. 2.5 kW (400 Volts / 50 Hz) Dimensions W x D x H: 2000 x 2000 x 2600 mm weight: 1200 kg colour: red RAL 3003 / grey RAL 7035

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